Semi Automatic Wire Bonder

OPTION CLAUSE: The Purchaser reserves the right to increase or decrease the quantity to be ordered up to 25 percent of bid quantity at the time of placement of contract. The purchaser also reserves the right to increase the ordered quantity up to 25% of the contracted quantity during the currency of the contract at the contracted rates. The delivery period of quantity shall commence from the last date of original delivery order and in cases where option clause is exercised during the extended delivery period the additional time shall commence from the last date of extended delivery period. The additional delivery time shall be (Increased quantity ÷ Original quantity) × Original delivery period (in days), subject to minimum of 30 days. If the original delivery period is less than 30 days, the additional time equals the original delivery period. The Purchaser may extend this calculated delivery duration up to the original delivery period while exercising the option clause. Bidders must comply with these terms.

Buyer Added text based ATC clauses Specifications for Semi Automatic Wire Bonder : The wire bonder should have provision for Thermosonic Wedge-Wedge, Ball-Wedge, Ribbon and Bump bonding The bonder should be able to use Gold and Aluminum wires of diameters ranging from 17 pm to 75 pm. Also Gold ribbons of width upto 251..tm x 2501im The Z & Y Axis movement, as well as the clamp movement should be motorized, with additional manual co ntrol of Z motion. The motorized Z axis travel movement should be 17 mm minimum and the motorized Y axis travel movement should be 10 mm minimum Motorized Z travel: 17mm, with 1pm incremental steps Motorized Y travel: lOmm, with 1pm incremental steps X Axis movement to be manual X-Y Table Movement: Manipulator (6:1) or better Stereo Microscope of minimum of 100 x magnification should be supplied Microscope should have arrangement to mount video camera (HDMI and SD card slot). Video camera to be supplied. At least 15" monitor to view the camera output Spot light targeting system should be available Wire feed angle: 90 degrees Z axis gap between two bonds: 0 mm to 15 mm Bond Tool depth access (Z axis): Up to 16mm Ultrasonic System: Frequency in range of 60 KI Iz to 65 KI-Iz_ Ultrasonic Power: 0 to 10 Watts or better Bond Time: 0-20000 milliseconds Bond Force: 05 to 150 grams Bond Actuation: Touch down sensor Supply Voltage @ 50 Hz: 220 - 240 VAC Single phase Illumination: Dual Optical fiber The work stage surface should have heating arrangement, should have a minimum diameter of 90 mm and also it should have adjustable height arrangement The work stage temperature should be variable between room temperature and minimum 250 °C. The bonder unit should be provided with dual illumination, touch screen TFT control panel of at least 6.5"for display and entry of bond parameters System should have motorized wire feed & user friendly changeover from ball to wedge configuration with just change of tool. Single bond head for all type of bonding, only changing of tool tip is needed for different wire bonding applications Electronic Ball Size Control Up to 100 programs storage capability. Also USB backup arrangement Programmable Loop Profile At least 5 wedge tools for 25pm Au wedge bonding should be included in the quote. At least 5 capillary tools for 25pm Au ball bonding should be included in the quote 100 m spool (2" spool) of 25pm Gold wire should be included in the quote. Total 5 spools required At least 5 wedge tools for 25-pm Aluminum wire wedge bonding should be included in the quote. 100m spool (2" spool) of 25pm Aluminum wire should be included in the quote. Total 5 spools required At least 5 wedge tools for 33pm Au wedge bonding should be included in the quote. At least 5 capillary tools for 33pm Au ball bonding_should be included in the quote 100 m spool (2" spool) of 33pm Gold wire should be included in the quote. Total 5 spools required At least 5 wedge tools for 3311m Aluminum wire wedge bonding should be included in the quote. 100m spool (2" spool) of 33pm Aluminum wire should be included in the quote. Total 5 spools required Tool box (usually consisting of 2 tweezers, allen keys, hook, 1 substrate, 3 Cu-screws, 1 glass, 1 torque wre nch) to be provided with the wire bonder The product should have a minimum warranty of one year Technical support should be available within India The manufacturer should provide list of Indian customer reference base along with technical bid. At least 2 0 machines to be installed in India. Bidder should have supplied at least 10 similar equipment in past thre e year in the country. Wire Bonder should be CE Certified. CE Certificate should be provided Wire Bonder should be ESD protected. ESD Certificate should be provided Copper Ball Bonding Kit including- 254 Copper wire 100m (2 Spools) Capillary tool for 25µ Copper ball bonding (5 Nos) 334 Copper wire 100m (2 Spools) Capillary tool for 33µ Copper ball bonding (5 Nos) Tool Heater Kit Warranty: 1 Year Payment: After receipt of goods / Letter of credit .